Samsung

ASML partners with TSMC, Samsung, and Intel to boost EUV throughput by 40%: ASML has secured agreements with Samsung, TSMC, and Intel to transition to larger photomasks, which is expected to increase the throughput of its newest EUV machines by 40 percent.

Hardware • The Decoder

Samsung and TSMC commit to adopting ASML High NA EUV machines by 2030: Samsung and TSMC have committed to adopting ASML's High NA EUV lithography machines by 2028 and 2030, respectively, joining Intel. Additionally, all four major chipmakers have agreed to transition from 6-inch to 12-inch photomasks for semiconductor production.

Hardware • Techmeme