Samsung

ASML partners with TSMC, Samsung, and Intel to boost EUV throughput by 40%: ASML has secured agreements with Samsung, TSMC, and Intel to transition to larger photomasks, which is expected to increase the throughput of its newest EUV machines by 40 percent.

Hardware • The Decoder

Samsung and TSMC commit to adopting ASML High NA EUV machines by 2030: Samsung and TSMC have committed to adopting ASML's High NA EUV lithography machines by 2028 and 2030, respectively, joining Intel. Additionally, all four major chipmakers have agreed to transition from 6-inch to 12-inch photomasks for semiconductor production.

Hardware • Techmeme

Mistral • Series D

Mistral raises €3 billion in Samsung-led round at €21 billion valuation: French AI startup Mistral has raised a €3 billion Series D funding round led by Samsung. The investment values the company at €21 billion, up from €11.7 billion a year ago. Mistral plans to use the capital to expand into data centers beyond its core focus of developing AI models.