Skip to content

Hardware

Topic archive7 matches

Back to homeGEO summary endpoint

2026-09-14

Technology

  • China Mobile Cloud debuts GPU-neuromorphic inference system: China Mobile Cloud and its partners have introduced a domestic GPU plus neuromorphic heterogeneous mixed-inference system for large models. Tested on DeepSeek V4 Flash, the system reportedly delivers approximately twofold output and energy gains alongside a 40% reduction in operating expenses.

    HardwarePandaily

    Permalink

2026-09-09

Technology

  • CXMT reportedly starts HBM3E risk production with samples sent to T-Head: ChangXin Memory Technologies has reportedly started risk production for HBM3E, with early samples undergoing qualification at Alibaba's T-Head and Cambricon. Yields, volumes, and final specifications remain undisclosed. Optimistic timelines suggest commercial production could begin around 2027.

    HardwarePandaily

    Permalink
  • ASML partners with TSMC, Samsung, and Intel to boost EUV throughput by 40%: ASML has secured agreements with Samsung, TSMC, and Intel to transition to larger photomasks, which is expected to increase the throughput of its newest EUV machines by 40 percent.

    HardwareThe Decoder

    Permalink

2026-09-08

Technology

  • Arm introduces Neoverse CSS N4 platform for cloud computing: Arm has introduced its next-generation Neoverse CSS N4 semi-custom chip design platform for cloud computing. The platform supports configurations ranging from 8 to 128 Neoverse N4 cores at speeds up to 3.8 GHz, built on TSMC's N3P process node.

    HardwareTechmeme

    Permalink
  • Samsung and TSMC commit to adopting ASML High NA EUV machines by 2030: Samsung and TSMC have committed to adopting ASML's High NA EUV lithography machines by 2028 and 2030, respectively, joining Intel. Additionally, all four major chipmakers have agreed to transition from 6-inch to 12-inch photomasks for semiconductor production.

    HardwareTechmeme

    Permalink