Hardware

CXMT reportedly starts HBM3E risk production with samples sent to T-Head: ChangXin Memory Technologies has reportedly started risk production for HBM3E, with early samples undergoing qualification at Alibaba's T-Head and Cambricon. Yields, volumes, and final specifications remain undisclosed. Optimistic timelines suggest commercial production could begin around 2027.

Hardware • Pandaily

ASML partners with TSMC, Samsung, and Intel to boost EUV throughput by 40%: ASML has secured agreements with Samsung, TSMC, and Intel to transition to larger photomasks, which is expected to increase the throughput of its newest EUV machines by 40 percent.

Hardware • The Decoder

Arm introduces Neoverse CSS N4 platform for cloud computing: Arm has introduced its next-generation Neoverse CSS N4 semi-custom chip design platform for cloud computing. The platform supports configurations ranging from 8 to 128 Neoverse N4 cores at speeds up to 3.8 GHz, built on TSMC's N3P process node.

Hardware • Techmeme

Samsung and TSMC commit to adopting ASML High NA EUV machines by 2030: Samsung and TSMC have committed to adopting ASML's High NA EUV lithography machines by 2028 and 2030, respectively, joining Intel. Additionally, all four major chipmakers have agreed to transition from 6-inch to 12-inch photomasks for semiconductor production.

Hardware • Techmeme

NVIDIA Doubles Down on Local AI With PAIR: NVIDIA has announced the launch of the Personal AI Router (PAIR), a new form of local router designed to enhance local AI capabilities. The open-source project allows users to route and manage AI workloads locally on RTX-powered hardware.

NVIDIA • Sam Witteveen

DeepSeek plans 160,000-chip Huawei AI cluster in Inner Mongolia: DeepSeek plans to deploy at least 160,000 Huawei Ascend 950DT accelerators at a new data center in Inner Mongolia. The proposed installation would be among the largest known clusters of Huawei AI chips. However, the deployment schedule remains dependent on Huawei's production capacity.

Hardware • TechNode