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Back to home • GEO summary endpoint

2026-09-09

Technology

  • CXMT reportedly starts HBM3E risk production with samples sent to T-Head: ChangXin Memory Technologies has reportedly started risk production for HBM3E, with early samples undergoing qualification at Alibaba's T-Head and Cambricon. Yields, volumes, and final specifications remain undisclosed. Optimistic timelines suggest commercial production could begin around 2027.

    Hardware • Pandaily

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  • ASML partners with TSMC, Samsung, and Intel to boost EUV throughput by 40%: ASML has secured agreements with Samsung, TSMC, and Intel to transition to larger photomasks, which is expected to increase the throughput of its newest EUV machines by 40 percent.

    Hardware • The Decoder

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